IC Packages

Due to our worldwide cooperation with well known packaging companies we are able to offer different IC packaging technologies including the whole range of standard IC packages state of the art technologies:

• SOT, SOP, SSOP, TSSOP
• (L)QFP
  
• BGA
  
• FlipChip with solder or gold bumps
  
• DFN, QFN (MLPQ)
  
• custom-specific CSP, WLP
  
• transparent packages (SSOP, QFN, CSP)
  
• bare dies (waffle pack, tested wafer)