ASICs –
Application Specific integrated Circuits
Mixed-Signal-ASICs
Today complex custom specific systems
consist of different parts:
analogue components as embedded sensors, signal amplifier, power supply
modules, DC/DC converters and high resolution AD and DA converters but
also complex digital signal processing, embedded microcontroller, a
white range of I/Os, bus interfaces and volatile or non volatile memories.
As specialists in this field we possess about a great know how and long
years of professional experience during a big number of realised circuits.
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| Analogue special circuits We
have access to different semiconductor technologies which are excellent
suited to create analogue circuits with different parameters and properties,
as
- High voltage circuits up to 600V
- Frequencies up to 3 GHz
- Integreated sensors (optical, temperature, Hall)
- Very exact bandgap voltage references
- Broadband, low offset and low noise OpAmps
Typical applications:
- sensor amplifier and -controller; also in the unprotected car board
net environment
- optical Transimpedance amplifier
- Smart-Power-power supply circuits (DC/DC-converter, intelligent
charging controller, motor controller)
- RF- Transmission systems (433/868 MHz)
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Digitale ASICs
With our large experiences in development of complex
digital systems using Verilog/VHDL programming and our know how for
implementing into modern CMOS semiconductor technologies we are well
prepared for development and design of customized digital circuits of
different complexity. With SYNOPSIS tools of the last release we are
able to offer the whole range of services and technical possibilities,
from pure conversion of a FPGA into a full customized ASIC up to complex
logic development and ASIC implementation using our state of the art
EDA tools.
Most of the digital designs are realised in close cooperation with our
customer. Very often an important interface is the already written VHDL-
or Verilog code or a FPGA specific description language code.
We possess about references in different kind of complex industrial
field bus ICs in the industrial automation and automotive industry.
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| Semiconductor-processes: As a „fabless
semiconductor vendor“we are able to offer for each different project
the best fitting semiconductor technology of different wafer foundries.
Using such pure wafer foundries without own IC-products guaranties a
long technology life time, stable technical parameters and best prices.
Current used technologies:
CMOS
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| 0,25 µm CMOS
- 1P5M (aluminium)
- 2,5V, 3,3V and 5V I/O-support
- Trench Isolation
- Mixed-Signal options: deep N-well, multiple VtMOSFET, high
resistor poly layer, MiM capacitors, thick film inductors
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0,5 µm CMOS
- 2P3M
- p-substrate
- high resistor poly layer
- double poly capacitors
- Vccmax 5V
- OTP/EPROM optional
- 14-17 masks
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0,8 µm HV-CMOS
- Vccmax 5V/18V
- 2P3M
- p-substrate or n-substrate
- high resistor poly layer
- double poly capacitors
- OTP/EPROM optional
- 17–22 masks
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Bipolare technologies (BJT) |
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| 1,5 µm Bipolar
- Uceo 12 V / 25 V / 35V
- 2M
- implanted resistors and capacity layer optional
- I2L-logic
- 10-14 masks
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5 µm Bipolar
- Uceo 10 V / 30 V / 40V
- 2M
- implanted resistors and capacity layer optional
- I2L-logic
- 8-13 masks
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BiCMOS
0,6 µm BiCMOS
- Bipolar: Uceo von 8,5 V
- Fmax 16 GHz
- Metal layer 2- 4
- 5V and 3,3V I/O libraries available
- up to 4600 effective gates/mm2
- EPROM optional
- integrated photo diode IP available
BCD
0,8 µm BCD
- 12V/5V/40V
- 2P2M
- p-Substrat
- Bipolar: Uceo von 12 V
- 17–22 maks
With the following foundry partners we have realised ASIC projects
already and exist a long term relationship for series production:
Foundry:
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CREATIVE CHIPS GmbH - Am Ockenheimer Graben
54 - 55411 Bingen am Rhein - info@creativechips.com
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